India's Semiconductor Milestone: Kaynes Semicon Ships Complex Chip Module to US

Kaynes Semicon has made history by shipping India's first commercially packaged multi-chip module to a US semiconductor firm. The advanced module contains 17 complex dies and represents a significant milestone in India's semiconductor manufacturing journey. This achievement aligns with the government's India Semiconductor Mission, aimed at boosting domestic high-tech production. The export highlights India's growing capabilities in sophisticated electronic component manufacturing.

Key Points: Kaynes Semicon Exports First Commercial Multi-Chip Module to AOS

  • First Indian commercial multi-chip module exported to global market
  • Advanced module contains 17 unique semiconductor dies
  • Supports India's semiconductor mission strategy
  • Demonstrates India's emerging high-tech manufacturing capabilities
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Kaynes Semicon dispatches India's first commercial multi-chip module to US firm

Kaynes Semicon achieves major semiconductor breakthrough, dispatching advanced multi-chip module to US firm with 17 unique dies

"This is a one-of-its-kind module, with 17 dies inside - Raghu Panicker, CEO Kaynes Semicon"

New Delhi, Oct 17

Semiconductor solutions provider Kaynes Semicon's OSAT facility in Sanand, Gujarat, has dispatched India's first commercially packaged multi-chip module (MCM) to Alpha & Omega Semiconductor in California, delivering approximately 900 intelligent power modules, a report has said.

"This is a complex chip that we assembled, tested for quality, marked and packaged for AOS, and rolled out from our Sanand OSAT. We have a capacity to do 3,000 pieces per day. We will send another shipment next month," Raghu Panicker, CEO, Kaynes Semicon, was quoted as saying in media reports.

"This is a one-of-its-kind module, with 17 dies inside, six IGBTs, two controller ICs (integrated circuit), six FRDs (fast recovery diode), and three diodes, placing it among the most advanced in this domain," he added.

The company commenced its pilot-line manufacturing in April under the India Semiconductor Mission 1.0, backed by a central government commitment of Rs 1,653.5 crore.

An intelligent power module (IPM) is an electronic chip that packs together parts used to control and protect the flow of electricity. It helps make devices like motors run more smoothly and efficiently while saving space and simplifying power control.

Kaynes Semicon has tied up 100 per cent of its capacity of around 4.6 billion chips per annum with global and Indian companies.

India Semiconductor Mission (ISM) was launched in 2021 with a Production Linked Incentive (PLI) scheme worth Rs 76,000 crore to boost domestic manufacturing and design in the semiconductor sector.

India's semiconductor market stood at $38 billion in 2023 and is expected to hit $45 to $50 billion in 2024-25 and $100 to $110 billion by 2030. Globally, the semiconductor market is projected to grow to $1 trillion by the same year.

- IANS

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Reader Comments

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Priya S
Amazing achievement! 17 dies in one module is quite sophisticated. The ₹76,000 crore PLI scheme seems to be yielding results. Hope this encourages more Indian engineers to stay and work in India rather than going abroad.
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Michael C
While this is a positive step, I hope the government ensures proper environmental safeguards in semiconductor manufacturing. The water and energy requirements are massive. Sustainable growth should be the priority.
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Ananya R
As an engineering student, this news is so inspiring! 🚀 The fact that we're competing in high-tech semiconductor packaging gives me hope for India's technological future. Can't wait to see what's next!
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Sarah B
Great to see India moving up the value chain from just software to hardware manufacturing. The $100 billion market projection by 2030 shows the massive potential. Hope this reduces our electronics import bill significantly.
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Vikram M
The capacity of 4.6 billion chips annually is impressive! But I hope the focus remains on quality and innovation, not just quantity. We need to build a reputation for reliability in global markets.

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