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Odisha Breaks Ground on Advanced Semiconductor Chip Packaging Unit

Odisha has taken a significant step into the global semiconductor industry with the groundbreaking of 3D Glass Solutions' advanced chip packaging facility in Bhubaneswar. The unit will produce advanced glass panel substrates and 3D Heterogeneous Integration modules for applications in defense, AI, and automotive sectors. Union Minister Ashwini Vaishnaw hailed the event as historic, signaling Odisha's emergence as a key IT and electronics manufacturing hub. The project, backed by global investors like Intel, is central to the state's strategy to diversify its industrial base beyond traditional minerals.

Key Points: Odisha Launches Advanced Semiconductor Packaging Plant

  • Groundbreaking for advanced chip packaging unit
  • Part of Odisha's push into semiconductors
  • Facility to produce glass substrates and 3D modules
  • State diversifying from metals to high-tech
3 min read

Odisha breaks ground on 3D Glass Solutions advanced glass chip packaging unit; State eyes top-tier semiconductor hub status

Odisha begins construction of 3D Glass Solutions' advanced chip packaging unit, aiming to become a top-tier semiconductor hub in India.

"It is indeed a very important day, a historical day today for Odisha because the semiconductor plant foundation will be done today. - Ashwini Vaishnaw"

New Delhi, April 19

Odisha took a major leap into the global semiconductor value chain on Sunday as Chief Minister Mohan Charan Majhi performed the groundbreaking for 3D Glass Solutions Inc.'s advanced chip packaging unit in Info Valley, Bhubaneswar, in the presence of Union Electronics and IT Minister Ashwini Vaishnaw and other distinguished guests. The facility is set to bring "world's most advanced technology" to Odisha, positioning the state in the "top-tier of chip packaging."

3DGS will set up a vertically integrated advanced packaging and embedded glass substrate unit that will bring "the world's most advanced packaging technology to India." The plant will host a wide range of next-generation technologies, including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration (3DHI) modules.

Planned capacity is approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. The products will have "significant applications in defence, high-performance computing, artificial intelligence, RF and automotive, photonics and co-packaged optics."

The Centre had approved semiconductor manufacturing units in Odisha in 2025, including projects by SiCSem Private Limited and 3D Glass Solutions Inc. (3DGS). SiCSem, in collaboration with Clas-SiC Wafer Fab Ltd., UK, will establish India's first commercial compound semiconductor fabrication unit in Info Valley, Bhubaneswar.

Speaking on the sidelines of the curtain raiser event, Union Minister Ashwini Vaishnaw termed the foundation laying a "historic day" and said the state is emerging as a key hub for advanced technology and electronics manufacturing, an "IT hub", in India.

Speaking to ANI, the Union Minister highlighted Odisha's rapid industrial transformation. He said, "It is indeed a very important day, a historical day today for Odisha because the semiconductor plant foundation will be done today. It's very important for Odisha to have a world-class, latest technology industry here. Odisha is now becoming an IT hub. It is becoming an electronics manufacturing hub. It is diversifying from metals and minerals to many new industrial bases."

Additional Chief Secretary of Odisha's Energy Department Vishal Dev called the development a major boost to the state's semiconductor ecosystem. He said, "It's a great development for the electronics and semiconductor ecosystem of Odisha. 3DGS is a pioneering company across the world. Its investors include Intel and Lockheed Martin, which are global leaders. So it's a great development for us, and I'm sure it will pave the way for further investments in the semiconductor sector in Odisha."

The 3DGS unit is Odisha's push to move beyond its traditional metals and minerals base and anchor high-end electronics and semiconductor manufacturing, leveraging central approvals and global investor interest to build a diversified industrial profile.

- ANI

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Reader Comments

A
Arun Y
As someone from Bhubaneswar, I'm thrilled. For decades, our youth had to migrate to Bangalore or Hyderabad for tech jobs. If this creates high-quality local employment and boosts the economy, it's a game-changer. Hope the execution matches the promise.
R
Rahul R
Defence and AI applications mentioned are crucial. Strategic autonomy in chip manufacturing is a national security imperative. Glad to see companies like Intel and Lockheed Martin are investorsā€”brings global credibility. Hope the technology transfer is real and substantial.
S
Sarah B
While this is a positive step, I hope the environmental impact and resource use (water, energy) for such a high-tech plant are thoroughly studied and managed. Odisha has beautiful ecology. Development shouldn't come at its cost.
K
Karthik V
"Diversifying from metals and minerals" is the key phrase. Odisha's growth has been tied to mining for too long. This is a visionary shift. If successful, it could be a blueprint for other resource-rich states to modernize their economies. šŸ¤ž
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Michael C
The numbers are impressiveā€”69,600 panels, 50 million units. But let's be realistic. Setting up a cutting-edge fab is one thing, achieving sustained high yields and competing globally on cost and quality is another. The government must ensure consistent policy support.

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