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SK hynix Unveils 48GB 16-Layer HBM4 for Next-Gen AI at CES 2026

SK hynix has introduced its next-generation AI memory chips, including a 48GB 16-layer HBM4, at CES 2026. The company is developing this high-bandwidth memory in alignment with specific customer roadmaps to meet the technical demands of global tech firms. It also showcased its market-leading 12-layer HBM3E and new modules like cHBM, which integrates computation functions directly into the memory. The exhibition highlighted the company's focus on providing differentiated, high-efficiency solutions for the evolving AI ecosystem.

Key Points: SK hynix Reveals 16-Layer HBM4 AI Memory at CES 2026

  • 48GB 16-layer HBM4 unveiled
  • Targets AI inference efficiency
  • Features 12-layer HBM3E for 2024
  • Showcases cHBM and SOCAMM2 modules
  • Includes 321-layer NAND flash
2 min read

SK hynix reveals 48GB 16-layer HBM4 for high-efficiency AI at CES 2026

SK hynix debuts 48GB 16-layer HBM4 and new AI memory solutions at CES 2026, targeting higher efficiency for AI workloads.

"As innovation driven by AI accelerates, customers' technical requirements are evolving rapidly. - Kim Joo-sun"

Seoul, January 6

SK hynix unveiled its next generation of artificial intelligence memory chips, including a 16-layer HBM4, at CES 2026 in Las Vegas on Tuesday. The chipmaker opened a customer-only exhibition booth to deepen engagement with key clients as the demand for high-performance memory continues to rise.

According to a report by The Korea Herald, this debut marks a significant step in the company's efforts to provide differentiated memory solutions for the evolving AI ecosystem.

The 16-layer HBM4 model features a capacity of 48 gigabytes. This follows the development of the company's 12-layer HBM4 with 36GB, which previously recorded the industry's fastest speed of 11.7 gigabits per second. The company stated that the new 16-layer version is currently under development in line with specific customer roadmaps. This advancement aims to address the technical requirements of global technology firms seeking higher efficiency for AI-driven workloads.

"As innovation driven by AI accelerates, customers' technical requirements are evolving rapidly," the report quoted Kim Joo-sun, president and head of AI Infrastructure at SK hynix. "We will respond with differentiated memory solutions and create new value through close cooperation with customers to advance the AI ecosystem."

The exhibition also features the 12-layer HBM3E, a product SK hynix expects to lead the market throughout the current year. To demonstrate its role within complete AI systems, the company displayed GPU modules that incorporate these chips for AI servers.

An AI System Demo Zone was established to show how these memory solutions interconnect. This zone includes a large-scale mock-up of a Custom HBM (cHBM) module, which is optimized for specific AI chips or systems to improve overall performance.

"As competition in the AI market shifts from raw performance to inference efficiency and cost optimization, this design visualizes a new approach that integrates some computation and control functions into HBM -- functions previously handled by GPUs or ASICs," the report quoted the company.

Additionally, SK hynix showcased SOCAMM2, a low-power memory module for AI servers, and a 321-layer 2-terabit QLC NAND flash product designed for ultra-high-capacity enterprise SSDs.

- ANI

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Reader Comments

P
Priya S
The shift from raw performance to inference efficiency and cost is the real story here. For a price-sensitive market like India, this could make advanced AI applications more viable for SMEs and the public sector. Hope we see some local manufacturing or assembly deals soon.
R
Rohit P
Wow, 48GB on a single chip! The pace of innovation is mind-blowing. Just a few years ago this would have been science fiction. Excited to see what Indian AI researchers can build with this kind of power. 🚀
S
Sarah B
While the tech is impressive, I hope the environmental cost of producing these advanced chips and running these power-hungry AI servers is also being addressed. Sustainability needs to be part of the roadmap, not just performance.
V
Vikram M
The focus on "customer-only exhibition" says it all. This tech is for the big global players. Makes you wonder when Indian semiconductor and hardware companies will be in a position to innovate at this level. We have the talent, need the ecosystem and investment.
K
Karthik V
Good to see the low-power SOCAMM2 module mentioned too. For a country with power challenges like ours, energy efficiency in data centers is as crucial as raw speed. This could be a game-changer for hosting AI workloads locally.

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