PM Modi Opens SEMICON India 2026, Highlights Chip Manufacturing Push

PM Modi inaugurates SEMICON India 2026 at Yashobhoomi in New Delhi

New Delhi, September 17

The event, being held from September 17 to 19, will focus on industry engagement, policy direction and international partnerships.

India's electronics manufacturing sector has expanded significantly over the last 11 years, with electronics goods production increasing nearly six-fold and mobile phone exports rising 127 times between 2014-15 and 2024-25, according to government data.

The country's electronics manufacturing strategy is driven by the vision of AtmaNirbhar Bharat and making India a global manufacturing hub. The Government has adopted a structured and targeted policy for electronics manufacturing across the entire value chain, including semiconductors.

Electronics goods production increased from around Rs 1.9 lakh crore in 2014-15 to around Rs 12 lakh crore in 2024-25, registering a six-fold increase. Exports of electronics goods rose from Rs 38,000 crore to around Rs 3.3 lakh crore during the same period, an eight-fold increase.

Mobile phone production increased from Rs 18,000 crore in 2014-15 to Rs 5.45 lakh crore in 2024-25, a 28-fold rise. Mobile phone exports increased from Rs 1,500 crore to Rs 2 lakh crore, while the share of imported mobile phones fell from 75 per cent of total demand to 0.02 per cent.

The Government launched the Semicon India Programme in January 2022 to promote the development of a complete semiconductor manufacturing ecosystem in India, covering design, fabrication, assembly, testing, packaging and module manufacturing.

In four years, the Government has approved 10 semiconductor projects with investment commitments of about Rs 1.6 lakh crore. Commercial production from two plants, Micron and Kaynes, has commenced, while two more plants are scheduled to start commercial production this year.

The Government is also developing India's chip design ecosystem by providing chip design tools from eight companies to 315 universities at no cost. Their usage has exceeded 200 lakh hours, while 211 chips have been taped out by 75 institutions across India.

The Government has approved 24 projects for semiconductor chips and SoCs, covering sectors including video surveillance, drone detection, energy metering, microprocessors, satellite communications, broadband and IoT SoCs.

Of these, 14 companies have raised more than Rs 650 crore in venture capital funding to scale up and productise their solutions. Seven chips have been successfully fabricated at various nodes, including advanced nodes such as 12 nm.

To strengthen bilateral collaboration on resilient semiconductor supply chains, the Government has entered into MoUs with the United States, Japan, the European Union, Singapore and the Netherlands.

The growth of electronics manufacturing has also generated employment. As per industry estimates, the sector supports around 25 lakh direct and indirect jobs, including around 12 lakh jobs supported by the mobile phone manufacturing sector across manufacturing, logistics, supply chains and allied services.

Under the India Semiconductor Mission, 10 semiconductor units are under construction. Meanwhile, 249 applications have been received under the Electronics Component Manufacturing Scheme for components, base materials and capital equipment such as PCBs, capacitors and laminates.

Ten semiconductor manufacturing projects with investment commitments of around Rs 1.6 lakh crore have been approved across six states, with facilities planned in Gujarat, Assam, Uttar Pradesh, Odisha, Punjab and Andhra Pradesh.

The approved projects span semiconductor fabrication, assembly, testing, packaging, display driver ICs and other advanced semiconductor technologies.

Micron Technology Inc. is establishing a semiconductor manufacturing facility in Gujarat with an investment of Rs 22,516 crore. The facility will undertake assembly and testing of DRAM and NAND products for domestic and international markets, with a production capacity of around 14 million units per week.

Tata Electronics Private Limited (TEPL) is establishing a semiconductor manufacturing facility in Gujarat with an investment of Rs 91,526 crore. The fab will be set up in a technology partnership with PSMC, Taiwan, and will have a production capacity of around 50,000 wafer starts per month.

TEPL is also establishing a semiconductor manufacturing facility in Assam with an investment of Rs 27,120 crore. The facility will use indigenous semiconductor packaging technologies and have a production capacity of 48 million units per day.

CG Power and Industrial Solutions Limited is setting up a semiconductor manufacturing facility in Gujarat with an investment of Rs 7,584 crore. The facility will be established as a joint venture with Renesas Electronics America Inc., USA, and STARS Microelectronic, Thailand, with a production capacity of around 15.07 million units per day.

Kaynes Technology India Limited is establishing a semiconductor manufacturing facility in Gujarat with an investment of Rs 3,307 crore for wire bond interconnect and substrate-based packages. The facility will have the capacity to produce more than 6.33 million chips per day.

In Uttar Pradesh, Vama Sundari Investments (Delhi) Private Limited is establishing a semiconductor manufacturing facility with an investment of Rs 3,706 crore for display driver ICs using Gold Bump technology, along with chip probing facilities and die processing services. The facility, to be set up in partnership with Foxconn India, will have a production capacity of around 20,000 wafers per month or 36 million chips per month.

Odisha will have two semiconductor facilities. 3D Glass Solutions Inc. is establishing a facility with an investment of Rs 1,943 crore for assembly of packaged products, glass interposers and 3D heterogeneous integration modules.

SiCSem Private Limited is establishing a semiconductor manufacturing facility in Odisha with an investment of Rs 2,066 crore. The facility will have a production capacity of 5,000 wafers per month and packaging capacity of eight million units per month.

In Punjab, Continental Device India Private Limited is expanding its semiconductor manufacturing facility with an investment of Rs 117 crore. The facility will manufacture high-power discrete semiconductor devices, including MOSFETs, IGBTs, Schottky bypass diodes and transistors, in silicon and silicon carbide, with a production capacity of around 158.38 million units annually.

In Andhra Pradesh, Advanced System in Package Technologies Private Limited is establishing a semiconductor manufacturing facility with an investment of Rs 480 crore in a technology partnership with APACT Co. Ltd., South Korea. The facility will have a production capacity of around 96 million units annually.

— ANI